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Shenzhen YYUXING Electronics Co., Ltd.
Shenzhen YYUXING Electronics Co., Ltd. Professional PCB manufacture,PCB Assembly service
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2 Layer PCB Board(HAL Lead Free finished)

Shenzhen YYUXING Electronics Co., Ltd.

2 Layer PCB Board(HAL Lead Free finished)

Place of Origin : china

Brand Name : YYUXING

Model Number : mkpcb17037

Certification : UL,SGS,Rohs

MOQ : 10pcs

Packaging Details : standarded packaging

Delivery Time : 7-18days

Payment Terms : L/C,T/T,Western Union

Supply Ability : 1000pcs/per week

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2 Layer PCB Board(HAL Lead Free finished)

Quote requirement:

1)Gerber file and Bom list

2)Clear pics of pcba or pcba sample for us

3)Test method for PCBA

2-18 Layer PCB Board Manufacturer

1.2 layer pcb board fabricate/layout
2.UL, SGS, Rohs Certificate
3.Competitive Price, Hgih Quality, Fast delivery
4.E-test, OEM Service are welcome

1.Detailed Specification of PCB Manufacturing

1 Layer 1-30 layer
2 Material FR-4, CEM-1, CEM-3, Hight TG, FR4 Halogen Free, FR-1, FR-2
3 Board thickness 0.2mm-7mm
4 Max.finished board side 500mm*500mm
5 Min.drilled hole size 0.25mm
6 Min.line width 0.075mm(3mil)
7 Min.line spaceing 0.075mm(3mil)
8 Surface finish/treatment HALS/HALS lead free, Chemical tin, Chemical Gold, Immersion gold Inmersion Silver/Gold, Osp, Gold Plating
9 Copper thickness 0.5-4.0oz
10 Solder mask color green/black/white/red/blue/yellow
11 Inner packing Vacuum packing, Plastic bag
12 Outer packing Standard carton packing
13 Hole tolerance PTH:±0.076, NTPH:±0.05
14 Certificate UL, ISO9001, ISO14001, ROHS, CQC
15 Profiling Punching Routing, V-CUT, Beveling
16 Assembly Service Providing OEM service to all sorts of printed circuit board assembly

2.Detailed Terms for Pcb Assembly

Technical requirement:

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206, 0805, 0603 components SMT technology

3) ICT(In Circuit Test), FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL, CE, FCC, Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.


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